Authors:Muhannad S. Bakir, James D. Meindl,
Publisher: Artech House Publishers
Keywords: integrated, microsystems, systems, technologies, interconnect, nanoelectronic
Number of Pages: 528
Published: 2008-11-30
List price: $159.00
ISBN-10: 1596932465
ISBN-13: 9781596932463

Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale SoC. This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches,

Authors:Sudarshan Bahukudumbi, Krishnendu Chakrabarty,
Publisher: Artech House Publishers
Keywords: integrated, circuits, mircosystems, burn, test, level, testing, wafer
Number of Pages: 198
Published: 2010-02-28
List price: $99.00
ISBN-10: 1596939893
ISBN-13: 9781596939899

Author: University Of California Integrated Pest
Publisher: Agriculture & Natural Resource
Keywords: lettuce, publication, crops, cole, pest, management, integrated
Number of Pages: 112
Published: 1985-12-01
List price: $22.00
ISBN-10: 0931876702
ISBN-13: 9780931876707

Authors:Arman Vassighi, Manoj Sachdev,
Publisher: Springer
Keywords: integrated, circuits, systems, management, power, thermal
Number of Pages: 179
Published: 2006-01-04
List price: $149.00
ISBN-10: 0387257624
ISBN-13: 9780387257624

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This

Authors:Aurelio Ciancio, K.G. Mukerji,
Publisher: Springer
Keywords: integrated, management, pests, diseases, plant, forest, fruit, crops, nematodes
Number of Pages: 350
Published: 2009-04-28
List price: $199.00
ISBN-10: 140209857X
ISBN-13: 9781402098574

The fourth volume of the IPMD Series covers, in three Sections, emerging issues in the integrated management of main nematode parasites of fruit, tree and forest crops. The chapters provide basic data about the crops concerned, listing main nematode threats, in order to facilitate their detection and management. Special attention is given to the management strategies as experienced by farmers, nematologists and consultants, in different areas of the world, including exploitation of plant resistance sources and integrated or organic management. The first Section covers key nematode parasites of

Authors:Lynn Basford, Oliver Slevin,
Publisher: Nelson Thornes
Keywords: practice, integrated, campion, studies, caring, approach, theory, nursing
Number of Pages: 640
Published: 2003-09
List price: $58.50
ISBN-10: 0748758380
ISBN-13: 9780748758388

This interactive text encourages committed study. Each chapter carries clear learning objectives. It emphasises the importance of community care and the social and cultural aspects of nursing. It is suitable for students on practice-centred and academic courses. It responds directly to the demands of Fitness for Practice, Fitness for Purpose and Fitness for Award.

Authors:Yuan Xie, Jason Cong, Sachin Sapatnekar,
Publisher: Springer
Keywords: integrated, design, circuits, systems, microarchitectures, eda, circuit, three, dimensional
Number of Pages: 284
Published: 2009-12-10
List price: $129.00
ISBN-10: 1441907831
ISBN-13: 9781441907837

This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introducti