Thermal Conductivity 26/Thermal Expansion 14

Serves as a "trading post" for both the experimentalist and the theorist.

Illustrations and tables throughout.

Extensive subject and author index.

The International Thermal Conductivity Conference held its 26th annual meeting on August 6-8, 2001 in Cambridge Massachusetts. Each year, this conference is the premier international meeting on material science and technology. It attracts outstanding papers from leading materials specialists in all segments of this study. Published after the conference, this volume contains the complete edited texts with all tables and figures from the conference.

The conference was chaired by Rich Mannello with Paul Ricci as Vic Chair. Stephen E. Smith and Robert C. Campball served as Technical CO-Chairs. This publication also includes papers presented by The 14th International Thermal Expansion Symposium which was held concurrently with the Thermal Conductivity Conference.

In addition, this publication includes a brief Profile of the 22nd through 23rd ITCC and the 1st through 11th ITES and the combined 24th ITCC/12th ITES through 27th ITCC/15th ITES. It is a collection of major facets of each conference augmented with other information of interest. This information appears in the Appendix to these proceedings.