Thermal Conductivity 27 / Thermal Expansion 15

Authors:Hsin Wang, Wallace Porter
Publisher: DEStech Publications, Inc.
Keywords: thermal, expansion, conductivity
Number of Pages: 682
Published: 2004-10-01
List price: unknow
ISBN-10: 1932078347
ISBN-13: 9781932078343

Book Description:



Major presentation of new developments in materials science and technology

Applications in metals, composites, and polymers

Special emphasis on nanomaterials

98 participants from 16 different countries

Illustrations and tables throughout

Extensive subject index

The International Thermal Conductivity Conference-now in its 27th year- is a major international conference on materials science and technology. Seventy-five outstanding technical papers, from leading materials specialists from around the world, were presented at the conference. Published after the conference, this volume contains the complete edited texts with all tables and figures from the latest conference.

In additional to traditional topics such as thermal insulation, instrumentation and standards, the conference tried to highlight research in carbon nanotubes, nanomaterials, novel thin films, thermoelectric and composites. Thermal expansion measurements using X-ray and neutron diffraction methods were presented for the first. The conference highlighted the fact that conductivity and thermal expansion are playing important roles in advanced material research.


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