Authors:Fred D. Barlow III, Aicha Elshabini,
Publisher: CRC Press
Keywords: handbook, technology, interconnect, ceramic
Number of Pages: 456
Published: 2007-01-24
List price: $139.95
ISBN-10: 0849335574
ISBN-13: 9780849335570

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.Collecting contributions from an outstanding p

Authors:Aicha Eishabini-Riad, Fred D. Barlow, ISHN,
Publisher: McGraw-Hill Professional
Keywords: handbook, technology, film, thin
Number of Pages: 640
Published: 1997-11-01
List price: $97.95
ISBN-10: 0070190259
ISBN-13: 9780070190252

The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area.